JPS62171161U - - Google Patents
Info
- Publication number
- JPS62171161U JPS62171161U JP5926286U JP5926286U JPS62171161U JP S62171161 U JPS62171161 U JP S62171161U JP 5926286 U JP5926286 U JP 5926286U JP 5926286 U JP5926286 U JP 5926286U JP S62171161 U JPS62171161 U JP S62171161U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- board
- mounting plate
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structure Of Printed Boards (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5926286U JPS62171161U (en]) | 1986-04-19 | 1986-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5926286U JPS62171161U (en]) | 1986-04-19 | 1986-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62171161U true JPS62171161U (en]) | 1987-10-30 |
Family
ID=30890591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5926286U Pending JPS62171161U (en]) | 1986-04-19 | 1986-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62171161U (en]) |
-
1986
- 1986-04-19 JP JP5926286U patent/JPS62171161U/ja active Pending